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微型扁平封装產品

凭借其小型封装,微型扁平光耦合器非 常适合于高密度表面贴装应用。

半間距產品

凭借其微细而薄的封装,半间距产品非 常适合于表面贴装,如PCMCIA,高密 度印刷电路板。

Product of the Month

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